Weiner International Associates
           Weiner International Associates

 

 

February 2020

 

The China Printed Circuit Association (CPCA) has announced a new date for the March event that was postponed due to the Coronavirus epidemic. It stated that after negotiations with the National Exhibition and Convention Center (Shanghai), the 2020 International Electronic Circuits Exhibition (Shanghai) will be held from June 22 to 24, 2020. The CPCA says that the original venues and the pre-selected booths will be unchanged.

 

"In accordance with government guidelines and to protect the health and safety of exhibitors and guests, we regret to inform you of the postponement of SEMICON/FPD China 2020 and related events originally scheduled for March 18-20, 2020. SEMI China is actively working on a contingency plan for rescheduling of the event and will keep you informed as soon as a confirmed plan is in place. We apologize for any inconvenience caused by this change, but your safety is our top concern.

....

SEMI is evaluating the health risks the Novel Coronavirus poses at other upcoming exhibitions and conferences and will make decisions whether to hold them as planned on a case-by-case basis.

....

We wish you all the best and good health!"

Richard Salsman                                           Lung Chu
CFO & Vice President Operations, SEMI      President, SEMI China

 

Thursday, February, 29, 2020

 

China states that 95% of state owned businesses have resumed operations after the Coronavirus outbreak - but they still face l;abior shortages due to the total disruption of internal travel in sime regions. However, the majority of "smaller businesses" are having diffculties restarting their operations. The cost of air freight for exports is reported to have been driven up as much as tenfold as Europe's automotive companies are said to have purchased the majority of available space to keep its production lines running. The IPC's prediction of 5-week delays in shipments from China may have to be revised upwards. This is partly due to the internal breaks of domestic supply chains caused by an effective lockdown of a large segment of the country with with the closure of a number of airports and railroad stations as well as highways.

 

The IPC Raymond E. Pritchard Hall of Fame Council will address lessons learned in addressing supply chain disruptions in a new Forum designed for emerging managers as well as senior industry leaders at IPC APEX EXPO 2021.

 

Gary Evans, Economist at the Custer Consulting Group showed some fascinating charts at IPC APEX EXPO 2020 displaying the effects of smartphone cameras on the 35mm and other camera markets at the Custer booth.

 

Chemplate Materials of Barcelona Spain exhibited unit #2 of its new InduBond® X-PRESS 100 lamination press.

lamination press in the GreenSource Fabrication booth. Unit #1 is at GreenSource where unit #2 is destined to be shipped. 

The new press produces heat on the laminated material, and only the laminated material, of each layer of a press pack at the same time, at the same temperature level, without any thermal conduction. The Indubond is reported to provide greater uniformity and reduce press time severalfold over conventional systems.

 

German Robotics's CEO Norman Weiss was seen meeting at IPC APEX EXO 2020 with a number of companies seeking U.S. distribution rights to the amazing 7-axis Panda robot by Franka Emika.

 

Guangxin Materials, part of Jiangsu Hongtai, stated its net profit for 2019 will be about $12 million.

The company’s main products are PCB inks, special coatings (including solder masks) and other electronic chemicals. The products are mainly used in printed circuit boards, precision processing of electronic products and consumer electronics. In 2018, the company acquired Hunan Sunshine to strengthen its development of new UV materials.

Traditional solder masks have a high Dk and Df, which cannot meet the high-frequency transmission performance and heating resistance in the 5G communication era. Therefore, low Dk and low Df materials are the key. The 5G base station PCB requires high-frequency special solder masks, and the company claims to have the first-mover advantage. In 2019 Guangxin Materials had an ink production capacity of 6,500 tons. It has invested in an additional investment of 8,000 tons of production capacity and is beginning to scale up manufacturing in the new equipment.

 

Thursday, February 13, 2020

Taiwan-based ODMs’ plants in Kunshan, China are facing serious labor shortages at the moment with a majority of their workers still unable to return to work, according to sources from the upstream supply chain.

At the moment, major Chinese cities including Hangzhou, Zhengzhou, Guiyang, Harbin, Linyi, Shanghai, and Beijing, have all shut down their transportation connections to the "outside," preventing ODMs from acquiring existing or new workers. ----- Source: DIGITIMES

 

Semiconductors at the Wuhan COVD-19 epicenter

 

South Korea's memory maker, SK Hynix, is the largest foreign investor in Wuxi. It set up a new 10nm DRAM plant there last year at a total cost of $8.6 billion. It has a capacity of 180,000 12-inch wafers per month. Prior to the Coronavirus outbreak it had planned to increase its market share of DRAMs in China to 45% from last year's 35%.

 

Chinese specialty foundry house Hua Hong Semiconductor has also built the country’s first 12-inch power components foundry fab in Wuxi at total investment of $10 billion. The company had started trial production of 55nm chips since the third quarter of 2019. Monthly capacity was set at 40,000 wafers.

 

Government measures to contain the spread of the coronavirus in China delay the rollout of next-generation 5G telecom networks, one of China's major technology goals.

 

 

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